Technical background
（1）Ferrotec has been engaged in precise cleaning for 18 years, accumulated a large number of mature cleaning BKM, and continued to improve；
（2）Cooperate with world-renowned semiconductor equipment manufacturers to jointly develop leading cleaning technologies；
（3）In the first quarter of 2019, a Research and Development Centre for precision cleaning will be established to enhance the capability of failure analysis and advanced process research and development.
Clean environment
（1）Cu/Non-Cu is completely segregated by different production lines to reduce cross-contamination;
（2）Segregate cleaning of different processes, dedicated ceramic and quartz cleaning line to reduce pollution；
（3）The clean room adopts vertical flow mode, and the dust-free environment is easier to control；
（4）Dry-wet separation is used in clean room to reduce the risk of cross-contamination.
Equipment capability
Equipment | Shanghai Factory | Dalian Factory | Tongling Factory |
Air compressor | Oil | Oil | Oil-free |
CDA/N2 | CDA | N2(99.999%) | N2(99.999%) |
DI water | High-pure DIW（>16MΩ） | Ultra-pure DIW（>18MΩ） | Ultra-pure DIW（>18MΩ） |
Clean room | Turbulent circulation（Class 1000/Class 100） | Turbulent circulation（Class 1000/Class 100） | Vertical laminar circulation（Class 100/Class 10） |
Production Environment | Mixed products | Dedicated production line and controllable environment | Dedicated production line and controllable environment |
Automation | NA | Introduce automation equipment such as automatic bead blasting, power wash, etc. | Introduce automation equipment such as automatic bead blasting, power wash, etc. |
Precision measuring equipment
Measurement items | Measuring equipment | New factory |
Surface particle | Surface Particle Meter | 0.1um |
Liquid particle | LPC | 0.1um |
Key dimensions | CMM | 0.001mm |
Aperture | Imager | Fully automatic, 0.001um |
Micro-morphology | Keyence | 3000X |
Micro-crack | C-SAM | Cross-sectional scanning |
